2018年5月31日星期四

Sony Releases UXGA Resolution 0.5-inch OLED Microdisplay

Sony recently announced that it will soon release the ECX339A OLED microdisplay with UXGA resolution (1600 x 1200), which is currently the highest specification of this type of 0.5-inch. Using Sony's OLED display technology and miniaturization technology, the product achieves the world's smallest pixel pitch of 6.3 μm, resulting in a 1.6x increase in resolution over previous models.

Sony 0.5 inch OLED microdisplay ECX339A

By adopting a new driver circuit design that requires only half the voltage of the predecessor model, it achieves higher resolution while achieving the same level of low power consumption as the previous generation. Relevant person in charge said that when used in conjunction with Sony's original drive system, it can support up to 240Hz frame rate, 2 times the previous product.

Increasing the resolution on a microdisplay often suffers from degradation of image quality due to problems such as reduced pixel pitch and poor viewing angle. The new products use an optimized transistor layout and process to solve the problem of non-uniformity and breakdown voltage, all of which are related to transistor miniaturization. Sony's unique variation compensation circuit also improves picture quality. In addition, the filter is directly deposited on the silicon substrate, reducing the distance from the light emitting layer, and the color array of the filter is also modified. This helps to ensure viewing characteristics while achieving high resolution.

OLED microdisplays are widely used in digital camera electronic viewfinders (EVFs) for their superior high contrast, high color gamut, and high response. Sony has achieved this high resolution and high frame rate, and now it can provide more realistic image display and precise shooting theme for high-end cameras with extremely high image quality requirements.

Looking ahead, Sony hopes that this high-resolution OLED microdisplay can be applied in various fields and applications such as AR (Augmented Reality) and VR (Virtual Reality) head-mounted displays.

2018年5月30日星期三

Infineon expands TRENCHSTOP thin wafer IGBTs

nfineon is in volume production of an expanded portfolio of thin-wafer TRENCHSTOP 5 IGBTs.

The new product family is offering up to 40 A 650V IGBT, co-packed with a full rated 40 A diode in a surface mounting TO-263-3 also known as D2PAK.

The  TRENCHSTOP 5 IGBT in D2PAK package serves the growing demand for higher power density in power devices for automated surface mounted assembly.

Typical applications requiring highest power density and efficiency are solar inverters, uninterruptible power supply (UPS), battery charging, and energy storage.

The allows higher power density in a smaller chip size e.g. fitting a 40 A 650V IGBT together with a 40 A diode in D2PAK housing.

Compared to competing products in D2PAK, the new family claims to offer a higher rating than any other product on the market, with other co-packed solutions delivering only 75 percent of the power.

The high power density of the new devices enables designers to upgrade existing designs, to develop new platforms with up to 25% higher power output or to reduce the quantity of power devices used in parallel and thus allowing more compact designs.

The co-packed 40 A in D2PAK can be considered as an alternative to D3PAK or TO-247 used for surface mounting.

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2018年5月29日星期二

Smartphone sales bounce back in Q1; Xiaomi becomes a rising star

The worldwide mobile device market has rebounded after a difficult quarter to once again return to growth levels.

According to research firm Gartner, the global sale of smartphones to end users returned to growth digits in the first quarter of 2018, a 1.3 percent increase over the same period in 2017.

Close to 384 million smartphones were sold in the first quarter of this year, representing 84 percent of total sales. Sales of all kinds of mobile phones, including feature phones, reached 455 million units in Q1 2018.

"Demand for premium and high-end smartphones continued to suffer due to marginal incremental benefits during upgrades," said Anshul Gupta, research director at Gartner. "Demand for entry-level smartphones and low mid-tier smartphones improved thanks to better-quality models."

While there appears to be sluggish movement and weakness in the Chinese market which is impacting brands including Vivo and OPPO, Samsung's mid-tier range of smartphones is still being hampered by these competitors.

The South Korean tech giant is under pressure to perform, despite the launch of the new flagship Samsung Galaxy S9 and S9+. The Samsung Note 8 also provided a boost to sales figures, but as Chinese companies continue to secure customers, Samsung's growth has slowed, leading to an estimated 0.3 percent loss in market share.

Apple is still in second place, claiming an estimated 14.1 percent market share in Q1 2018. However, in comparison to Q1 2017's market share of 13.7 percent, the iPad and iPhone maker has enjoyed a boost in sales.

"Even though demand for Apple's iPhone X exceeded that of iPhone 8 and iPhone 8 Plus, the vendor struggled to drive significant smartphone replacement, which led to slower-than-expected growth in the first quarter of 2018," said Gupta. "With its exclusive focus on premium smartphones, Apple needs to significantly raise the overall experience of its next-generation iPhones to trigger replacements and lead to solid growth in the near future."

Huawei and Xiaomi secured the third and fourth top smartphone vendor spots respectively. Huawei's market share increased by 1.5 percent, while Xiaomi market share increased by four percent.


According to the research firm, Xiaomi is the star company over Q1, due to a growth boost of 124 percent year-on-year, with a 330 percent growth rate in the Asia Pacific region. The company's aggressive pricing strategy and increased popularity in India helped it achieve such strong growth.

In the operating systems market Google's Android continues to reign supreme with an estimated market share of 85.9 percent; however, it is worth noting that this has decreased from Q1 2017's 86.1 percent. Apple's iOS currently claims 14.1 percent of the market.


According to Gartner, worldwide IT spending will reach $3.7 trillion in 2018, an increase of 6.2 percent from 2017's figures.

Source from:ZDnet
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2018年5月28日星期一

Fully-matched, 5-6 GHz RF power transistor delivers 25W of power


INTEGRA TECHNOLOGIES IGT5259CW25 fully-matched, gallium nitride on silicon carbide (GaN/SiC), RF power transistor that is ideal for C-band, continuous wave (CW) applications. Device is fully matched to 50-ohms, operates at the instantaneous frequency range 5.2 – 5.9GHz, and delivers a minimum of 25W of output power at 36V drain bias. Device provides 12dB of gain and 48% efficiency at CW conditions. (Negative gate voltage and bias sequencing are required when utilizing this transistor.)

Source from:EPT
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2018年5月25日星期五

How to handle the MCU startup failure caused by the power supply?

For products that need to continue working for a period of time after the main power is turned off for data storage or alarms, we often can see large capacitance or even supercapacitors on the product PCB. Although the large-capacity capacitor can delay the power down of the system, the system can continue to perform the corresponding operation when the power supply is unexpectedly turned off, and if the power is re-powered at this time, it often encounters the problem that the system cannot be started. So what's going on here? What should I do with this situation?
First, power failure analysis
1. Start failure caused by slow power-up
For products that require power-down preservation or power-off alarm function, using the characteristics of slow discharge of large-capacity capacitors to achieve this function is often the choice of many engineers, so that the system depends on the capacitor's energy storage in the case of external power supply power-down To maintain the important data needed for the system to save and safely shut down. In addition, in the system that does not need to save power and save data, in order to prevent power supply ripple, power supply interference and load ratio variation caused by the fluctuation of the supply voltage, an appropriate filter capacitor is also connected to the output end of the power supply.
The addition of capacitance in the circuit allows the system to meet the design requirements in some aspects, but due to the presence of the capacitor, the system's power-on time will be prolonged accordingly. When the power is turned off, the capacitor discharges slowly and the power-off time will be longer. The extension of power-on and power-off time will often bring unexpected fatalities to MCUs.
For example, a certain series of MCUs can often encounter customer feedback that the system is powered on again after a power failure. The system fails to start. At first, the engineer thought that it was a software problem that took a lot of time and effort to find bugs. The problem is still not well resolved. Later checked the manual found that found that the series of MCU for the power-on time is a certain requirement (in fact, almost all brands of MCU have power sequencing requirements).



                                        Figure 1 Power on request

From Figure 1, we can see that the chip input power from the 200mV below the starting point to rise to VDD tr, manual requirements can not exceed 500ms. The large capacitance in the circuit and even the super capacitor obviously will greatly increase the power-on time. For a power supply design without detailed parameters, this time may even be more than 500ms. In this case, the power-on time requirement of the chip cannot be satisfactorily satisfied, resulting in the system being unable to start, or the problem of device latch-up caused by the disordered power-up sequence within the device.
Therefore, slow power-on of the power supply is sometimes a “headache” problem for MCU processors. How to effectively solve the problem of slow power-up? Don't worry about it. Let's talk about the problem of slow system power-down. And the problems caused by slow power-down are more common than the problem of long power-up time.
2. Start failure caused by slow power-down
In fact, there is a crucial parameter in the above-mentioned electrocardiogram, it is twait in the picture. We can see from the figure that the minimum value of twait is 12μs. The meaning of this parameter is that, before powering on, the chip's input power needs to be kept below 200mV for at least 12μs. This parameter requires our circuit to be powered back on. If the system needs to be powered back on, the chip's input supply voltage must be at least 200μs for at least 12μs. In other words, after the power is turned off, the power supply voltage of the MCU must be reduced to 200mV or less to be powered on again (12μs is very short, almost negligible), and the system can operate reliably.
Due to the large capacitance in the circuit, the system load is small, resulting in slow power down of the circuit. When we power on again, the chip power supply voltage may not yet fall below 200mV, as shown in Figure 2 below:



                       Figure 2 Slow Power-down and Power-up

Due to the large capacitance in the circuit, when the system load is not able to quickly discharge energy after the system is powered off, there will be slow power-down of digital devices such as the MCU. At this point, if the power supply is re-powered, the chip will not be “zeroed” in time because it does not meet the requirement of dropping below 200mV below 12μs as mentioned above. For digital devices such as MCUs, this is an indeterminate state. At this time, when the system is re-powered, the logic of the MCU may be confusing. As a result, the device latches up and the system cannot start.
Slow power-down can also cause chaos in the power-down sequence of digital devices such as MCUs. Especially for MCUs that require multiple power supplies, they have higher requirements for power-up timing and power-down timing, and internal timing disruptions can cause The device latches and the system does not start. This is why the system often fails to start when many products are restarted.
Therefore, we can see that the slow power-up or power-down of the system may cause the MCU to fail to start up or start up abnormally. How do you intervene on the slow power-up and discharge process to increase the power-up slope and shorten the power-down time?
Second, the solution recommended
When you encounter the problem of system startup failure, please use the oscilloscope to check whether the power supply pin of the device is slow and the power-down is slow and incomplete. When encountering this situation, you can choose to use the small-sized, low-resistance power conditioning module developed by Guangzhou Ligong Monolithic Technology Co., Ltd. in the circuit: QOD-ADJ.
The module can ensure that when the system is powered on, when the voltage reaches about 70%-75% of the rated voltage, the output is turned on. Then the output follows the input, which is equivalent to a very fast power supply to the system. When the power is turned off, the module can automatically discharge the residual voltage of the capacitor and can reach 100mV or less in a very short time, thereby solving the problem that the system is in a locked state when the power is turned on again in a short time. The so-called power-on is correct! The system can be stable and reliable.



                   Figure 3 QOD-ADJ module

QOD-ADJ has the following features:
l Fast power on when the system power is on, to increase the power-on slope;
l When the power is off, the capacitive load is quickly discharged to the state of nearly 0V;
l Externally controlled single channel load switch;
l It is simple and convenient to use, and the string can be controlled in the circuit.
Third, the use of products
Use the circuit shown in Figure 4 below to test our product:


                                           Figure 4 test circuit diagram

The power-on and power-down curves when VIN=5V, Cin=2.5F (supercapacitor), CL=100[mu]F, and RL=10[Omega] are shown in FIG. 5 and FIG. 6 shows the input 2.5F supercapacitor and load 10[Omega] power-down curves.

                Figure 5: Input 2.5F supercapacitor and load 10Ω power curve




                Figure 6 Input 2.5F supercapacitor and load 10Ω power off curve

1. Significantly reduced power-on time
It can be clearly seen from the above two diagrams that the VIN power-up curve (blue curve) climbs slowly because of the existence of a super capacitor, and after the module (Vout red curve), the power-on time is significantly shortened, enabling the subsequent circuit to be able to A certain state is reached in a short time.
2. Significantly accelerate power-down
It can be seen from the figure that when the system is powered off, due to the existence of a super capacitor, the front end (blue curve) of the module is slowed down, abnormally slow, and after passing through the module (red curve), the discharge speed can be significantly accelerated, making the subsequent circuit Get to a certain state in a very short time.
The devices in the system have strict requirements on the power supply and power on and off. In the product design, it is necessary to pay attention to the power-on and power-off requirements of the core devices, including the timing of power-on and power-off, and the slope, etc. Unreasonable designs often cause system power-on failure. Such abnormal conditions.

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2018年5月24日星期四

The new iPhone is coming. The next-generation A12 chip has begun mass production.

According to Bloomberg News on May 23, Beijing, informed sources said that Apple's manufacturing partner TSMC has begun mass production of the next generation of processors for the iPhone later this year.




Informed sources said that the new generation of processors is likely to be named A12, will use 7-nanometer process technology, than the current iPhone8, iPhone X and other Apple devices used 10nm chip is smaller, faster, more energy-efficient.

Apple and TSMC declined to comment.

More high-performance chips can help smartphone applications run faster and improve battery life. For smart phones, where growth has stagnated and the competition is fierce, high-performance chips are the key competitive advantage.

As the world's largest chip maker, TSMC said in April this year that it has started mass production of 7-nanometer processors, but did not disclose which specific customers produced the chip.


Apple will be one of the first handset makers to use new chip technology in consumer devices, but it is not the only one. As Apple’s biggest competitor, Samsung Electronics is preparing to add these parts to new handsets. Samsung said on Tuesday that it will begin production of 7-nanometer chips this year.

Apple also tried to grab this latest technology before Qualcomm’s 7-nanometer chip design was launched. The latter is the world’s largest manufacturer of mobile phone chips. Huawei is also using its mobile phones and self-designed processors to seize market share in the Chinese market.

Apple plans to release at least three new iPhones this fall, including a larger version of the iPhone X, an upgraded version of the current iPhone X, and a low-priced version. The low-priced iPhone will have many existing features of the iPhone X, but with a cheaper LCD screen.

TSMC plans to invest more than 10 billion U.S. dollars to expand production facilities at Hsinchu headquarters, including an R&D center that will develop the latest chip technology.

2018年5月23日星期三

2025 Global MicroLED Display Market to be Up to $20.5 Billion

According to related forecasts, the market for MicroLED displays is expected to grow at an alarming rate in the next six years. According to data provided by Research and Markets, an international market research organization, some markets will come from smart watches and include augmented and virtual reality, smart phones, televisions, humanitarian use devices (HUDs), digital signage, laptops, and monitors. NTE equipment and general and automotive lighting applications.

The research organization predicts that the global MicroLED display market will soar from US$600 million in 2019 to US$20.5 billion in 2025, with an average compound annual growth rate of 80.1%. The factors that drastically increased this huge demand include the demand for brighter, more energy-efficient display panels for smart watches, mobile devices and NTE (AR / VR) devices. Consumer electronics companies, Apple, Samsung and Sony all showed their interest in MicroLED display technology.

However, the company expects the growth of the OLED display market, the lack of existing supply chains for MicroLED, and the distributed patent portfolio that will inhibit the growth of the MicroLED display market.

After investigating the current manufacturing capabilities, prototype development, and participation of large electronics companies, the market research agency stated that MicroLED smart watches and NTE equipment may shift from the prototype development stage to actual product production in 2019. The MicroLED display market in NTE equipment is expected to achieve the highest CAGR between 2019 and 2025. Because the brightness and resolution of MicroLED display technology is the main driving force for its use in NTE equipment.

It is worth noting that AR equipment needs high resolution and high brightness to truly reflect the real world. In addition, these displays are the fast response time characteristics required for AR and VR applications. Potential VR applications using this technology may include gaming, entertainment, research, and training.

It is estimated that from 2019 to 2025, the Asia-Pacific region gathered by major brand manufacturers, LED foundries and display panel makers will occupy the global MicroLED display market. In 2025, Samsung, Sharp, Panasonic, LG, Sony and other companies will become the main demanders for MicroLED display panels.

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2018年5月22日星期二

This is definitely a revolution! AMD "bulldozer" will change history

Although AMD has been very good in the processor market in recent years, especially several cost-effective dual-core, three- and four-core processors listed to meet the eye of consumers, but also earned the silver, but with the introduction of the Core i series , AMD's processors do not have any advantages in performance, especially under Intel's "Tick-Tock" strategy, AMD has never had the initiative in the desktop processor area, while AMD playing in the processor field "Tianji horse racing" The strategy has also gradually emerged in decline. In the face of Intel's powerful technical strength and leading market share, AMD is a bit uncomfortable. Therefore, AMD can only hope to change the situation that has been oppressed by Intel once again with technological innovations. At the end of August of this year, AMD released a lot of information on the next generation of Bulldozer processor (Chinese codename “bulldozer”) to the outside world. Obviously, AMD will hope that all the Bulldozer processor!

Kernel design fully modular

AMD's "Bulldozer" is a new generation of processor architecture introduced after the K10. For AMD, this is a fundamental change in the AMD processor architecture since K7. The core architecture and functional quotient are larger than those of the K10. change. Compared to the current AMD mainstream processor architecture, the Bulldozer core's biggest highlight is the introduction of a modular design, which makes it easier for the processor to control costs on a more flexible basis. We all know that AMD's current core structure, whether it is a quad-core, a three-core or a dual-core, is solidified. It adopts a unified quad-core (or more) physical structure and is based on a market price strategy. Selective shielding of the kernel. This is difficult for AMD to control the cost of the product to win the cost, but also to the development of more core products in the current architecture almost to update the layout of the design substrate.

The modular design introduced by the Bullbozer processor just solves this problem. Bulldozer in the core design of each two cores constitute a separate unit (called "core module", two physical cores are integrated into a module), such as dual-core processors directly need to integrate a module on it, even eight The nuclear processor also only needs to integrate four modules, which makes product production and cost control more flexible. The two cores of the processor core module each have a level 1 cache, but the shared level 2 cache and prefetch, decoding unit, all The "core modules" share 8MB of L3 cache and the North Bridge module.

So how to define the number of AMD processor cores? The new architecture of the future quad-core processors refers to four such modules, or four computing cores? AMD's reply to this is: "Every bulldozer module that has a double-integer core is treated as a separate unit." Obviously, AMD can avoid the simple core number problem here, and more emphasis on two or two. The composition of the organic whole, so in the face of bulldozer architecture processor when we can say it is a four-core, eight-core, it can be said to be a two-module, four-module. Only in the future AMD may not have odd core processors.

Efficient cluster multithreading architecture

Another new element in the Bulldozer architecture is the use of cluster-based multithreading. Bulldozer's kernel module is a processing component that can run two threads at the same time. Two cores can execute two threads that do not interfere with each other at all. It is somewhat similar to Intel's dual-core processor's hyper-threading odd number.

Although dual-core, multi-threading, and Bulldozer are the same in terms of parallel execution of threads, the partitioning of the kernel is quite different. Multi-threading is a technology that runs multiple worker threads at the same time in a single processing core, and is different from the multi-processor technology of CMP chips. The latter is to increase the processing capacity of the system by integrating multiple processing cores. Now, it is mostly mainstream. The processor is using CMP technology, and the "hyper-threading technology" of processors such as the Pentium 4 and Core i7 is odd multi-threaded, while the Bulldozer is based on the clustered multi-threaded architecture, Cluster-Based Multi-threading : CMT, also known as multi-cluster multithreading technology.

In Intel's Hyper-Threading scheme, Hyper-Threading is used to duplicate the state of the processor architecture. There is no additional set of hardware execution units in the core to handle multi-threading. It only increases the data stored in the processor threads. The number of units, when the hardware execution unit is idle, sends this data to it while increasing processor utilization. This design has certain disadvantages. For example, it uses only one instruction window to handle the scheduling, execution, and retirement of two threads. This is not efficient. This is like having only one management dispatcher on the production line. It is difficult for one person to handle two tasks at the same time. In this case, production line failure sometimes occurs, and the performance of the processor significantly decreases when the processor encounters this condition.

Compared to traditional hyper-threading or dual-core technology, Bulldozer's philosophy of designing a clustered architecture is to make dual-core modules more efficient in multi-threaded operations. Bulldozer adds extra execution units to each module. Each module has the ability to subdivide a large task into multiple parallel tasks. These production lines can be arbitrarily integrated as needed without affecting the performance of the entire assembly line. Therefore, the effectiveness of CMT technology is higher than the traditional multi-threaded solution. According to AMD, a single "bulldozer module" can achieve about 80% improvement in multithreading performance, and the number of transistors used does not seem to be more than Intel's ultra-threaded odd number, which is a very encouraging achievement.

According to the roadmap, the Bulldozer architecture will release four-core, six-core, and eight-core versions, where the quad-core certificate performance is approximately 10% to 35% higher than the similar-frequency Phenom II X4. It should be noted that CMT is not AMD's unique technology. For example, Sun and Oracle developed the Niagara/Niagara2 (Ultra-SPARC T1/UltraSPARC T2) server processor. In particular, Niagara2 adopts a similar thread design as Bulldozer.

Stronger floating-point and integer computing performance

One of the big reasons why Bulldozer's clustered multithreading architecture can achieve such high performance is that AMD has increased the CPU's operating unit - two threads in each module have independent integer arithmetic units, only floating Point cells are shared, which is known as having "clusters" of two certificate operations units. Bulldozer's design, which separates the two threads' integer operations, can more effectively improve the processor's performance in basic applications. Because Intel's Nehalem architecture's hyper-threading odd number is that two hardware threads share three groups of operation units, conflicts are inevitable, and Bulldozer is two hardware threads that exclusively share four integer operation units, and the performance improvement will be more obvious. According to the structure diagram of the Bulldozer execution unit published by AMD, there are 4 groups (2 units per unit) of integer execution units responsible for integer operations and load/store units responsible for geological calculations. (In K7/K8/K10, there are only 3 such units, which corresponds to the ability of K7/K8/K10 to process 3 macros per cycle.)

It should be noted that Bulldozer this dual "cluster" also allows AMD in product design has a higher flexibility, the future processor rating can be achieved by controlling the number of "clusters": For example, the Bobcat processor is Cut out the Bulldozer of an integer "cluster". In addition, each module of Bulldozer also has two 128Bit FMAC (multiplication and accumulation operation) pipelines. Zhejiang can meet the needs of Bulldozer CITIC to join the AVX instruction set extension. This instruction set extension contains a large number of 128Bit multimedia instruction sets.

Process "two jumps"

With the doubling of the number of cores, processors have also imposed higher requirements on the production process. Therefore, in recent years, semiconductor manufacturers have also adopted a variety of letter technologies to use "More Moore" to maintain the Moore's Law. In the application of processor production technology, Intel has been walking in front of AMD, Core Duo has adopted 32nm process has been almost half a year, but AMD's products are still at 45nm! This situation will change with the birth of Bulldozer, Bulldozer will use 32nm process. It is expected that the 32nm process will begin trial production in the third quarter of 2010. The disease will provide AMD with production capacity in 2011. The 28nm process will be launched in the fourth quarter of 2010, while the ultra-low-power 28nm process will be ranked in the first quarter of 2011. Will use HKMG technology. This means that AMD will complete the "two-step jump" of product production process upgrade in 2010, evolved from 45nm to 32nm and then quickly evolved again to 28nm, recovering the time that Intel had fallen.

Previously, AMD has demonstrated the wafer map of their 28nm products, and it seems that the new technology seems to have been very close to the final availability. If we can really achieve a two-step jump in technology, then the long-disturbed AMD process process problems may be greatly improved, AMD will come out of the current dilemma into a new era of development.

The interface is upgraded again

Bulldozer architecture will use the new AM3 + interface, with 941 pins (AM3 is 938-pin, AM2+/AM2 is 940-pin), unlike the current 938-pin Socket AM3 interface, the advantage is that it can support DDR3 1866 memory and advanced technology. It should be noted that AM3+ is AMD's last-generation Pin Grid Array (PGA) package. Later, it will use a contact grid array (LGA), and will use the LGA AF1 new interface when the Fusion Fusion processor comes. How much is 1591? For compatibility, according to AMD, the AM3+ new interface processor cannot be used in the current AM3 socket hosting, but now the AM3 interface processor can be used in the future AM3+ new socket motherboard. In fact, AMD initially considered allowing the Bulldozer to use the AM3 interface, but then realized that a choice must be made to continue to provide AM3 and lose some of the new features of the new architecture, or upgrade the interface to bring better performance and functionality? Ultimately, AMD chose the latter for long-term benefits.

The Bulldozer processor will be used first for the server. The first chips are expected to be server processors code-named "Interlagos," with between 12 and 16 cores, expected to be released next year. For the desktop server market, Bulldozer will have three versions of 4/6/8 cores, with a three-level cache capacity of 8MB, support for DDR3 1866, and the first Zambbezi desktop processor with Bulldozer architecture will become AMD. The core of a generation of high-end desktop platform Scorpius.

Conclusion:

Should AMD's future trust be shouldered, could Bulldozer have the ability to "pull" Intel to the throne? This still needs time to prove. Taking into account Bulldozer this architecture itself is optimized for server applications, Bulldozer may bring a strong shock wave, but in the mainstream desktop area, Bulldozer architecture to defeat Intel's Core i is a long way to go. However, if the Bulldozer kernel is combined with the GPU to form a new generation of Fusion processors, its market competitiveness should be further improved, because Intel's GPU disadvantage is much greater than AMD's CPU disadvantages, in addition Bulldozer is floating The weakness in point processing can still be compensated by the powerful GPU part. In short, the transition to the Bulldozer architecture means that AMD's trend toward diversification, but also marks the transition from the multi-core era to system-level integration.

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2018年5月21日星期一

FREE!YIKESHU NES CASE, Functional POWER and RESET Button Retroflag NESPI CASE Rasberry Pi 3, 2 and B+ (NESPI CASE)

Hello everyone, bring a NES case for everyone today.
It has a functional power supply and a RESET button.
Next, we will introduce you in detail.

NES case specifically designed for Raspberry Pi 3, 2 and B+, with Functional Power and RESET Button.
This firm design, made out of plastic is held together with the 4 provided bolts
Easy access to the SD-Card and all other ports without opening the case
Inspired by the Nintendo Entertainment System.This case DOES NOT include any Raspberry Pi products.
Notice:1. There are some screws in the case, we want to remind you that screws are not used for NESPI CASE( NESPI CASE is not need these screws , it is used for Raspberry Pi )2.Power supply needs to reach more than 3A, it will not produce low voltage situation.

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Make a comment for my event.
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2018年5月18日星期五

Intel invests in three Chinese companies: IoT chip maker Lexin is on the list

On May 8, Intel, the US chip giant, announced at the Global Summit on Investment that it invested more than 72 million U.S. dollars in 12 technology startups. By now, Intel’s total investment in 2018 has exceeded US$115 million. There are three Chinese companies in this investment company, namely Lexin, Ruiwei and Lingqin. According to information disclosed by Intel, Lexin is a global fabless semiconductor company. The Wi-Fi+BT/BLE dual-mode system chip is widely used in tablet PCs and cameras at competitive prices. , wearables, smart home devices and other Internet of Things products.

2018年5月17日星期四

Edge computing will become mainstream still facing challenges such as computing power consumption, memory bandwidth, etc.

Because the sensor will generate too much data, it is difficult to pass it to the cloud, so edge computing is becoming the mainstream trend.
According to Semiconductor Engineering, the original idea of ​​the Internet of Things (IoT) device was that a simple sensor would send raw data to the cloud and process it through one or more gateways. These gateways may be located in companies, homes, factories, and even in cars. However, it is increasingly apparent that too much data must be processed. This method is not feasible.
Tien Shiah, who is responsible for HBM marketing for Samsung Electronics, said that a PC will generate 90MB of data each day. One car will produce 4TB per day, while the connected aircraft will be 50TB. Most of them are useless data.
If the preprocessing is done locally, then only by processing less data in the cloud, better performance can be achieved at a lower cost and with less power, thereby realizing the quick response required by the self-driving car, the drone, or even the robot. These are the reasons why edge operations suddenly get so much attention. It allows the computing task to be closer to the data source. In terms of driving a car, the final calculation may be performed on the sensor itself.
This is also important for artificial intelligence (AI), machine learning (ML) and deep learning (DL) applications. The key to AI/ML/DL is the ability to make inferences on the local device to improve security and performance. However, the bigger problem of inference is memory throughput. Frank Ferro, senior director of product management at Rambus, said that memory has once again become a bottleneck. Many emerging applications, whether AI or ADAS, require higher memory bandwidth.
In addition, these applications are mostly powered by batteries, or they must survive within a highly constrained power budget, and the difficulty of developing such devices becomes more challenging.
One of the biggest problems with edge operations is that it is a transformation technique that will be defined as it develops. Currently, it is still impossible to order special edge computing products that can support a combination of specific IoT devices, infrastructure, and computing requirements.
NVIDIA announced in late March that it is collaborating with ARM to integrate the NVIDIA Deep Learning Accelerator architecture with ARM's Project Trillium machine learning platform, allowing chip makers to easily add machine learning capabilities to IoT devices. Intel also introduced 14 new Xeon processors in February.
Both Intel and NVIDIA/ARM products can add more processing power near the endpoints, but neither of these products is ideal for sending data back to the cloud. According to Zeus Kerravala, chief analyst at ZK Research, the partnership between NVIDIA and ARM, as well as edge processors announced by Intel, are all basic products designed for devices, gateways, etc. that require increased processing capabilities.
The family IoT market may eventually exceed IIoT, but IIoT is setting the pace and agenda. Julian Watson, an analyst at market research agency IHS Markit, said that the demand for IoT gateways with edge computing capabilities is growing. The demand mainly comes from 3 specific areas: providing bridges for low-power nodes not directly connected to the network, such as Bluetooth Low Energy (BLE) or Zigbee based sensors; filtering traffic, deciding which data should be processed at the edge, and Which data is sent to the cloud; manage the security of these edge devices.
Michael Howard, executive director of IHS Markit, believes that IoT/edge gateways should at least be able to do the following: 1. Reduce the amount of raw data from IoT devices by integrating duplicate data. 2. Convert the data to a format that can be read by the upstream application. 3. Have an upstream application that can determine what data will be obtained and from which device. 4. Contains information on how to organize the data and optimize it.
Howard said that if the gateway cannot push the raw data into compact and practical data, pushing it upstream will only waste time and bandwidth. Processing must be done where the data occurs, preferably more than once.
All major system suppliers are eager to enter the market, but the demand for gateways is growing. This problem is more complex than collecting temperature data from several sensors. Especially in IIoT, the traditional SCADA and other automation systems in each vertical market are usually closed, proprietary, unfriendly to new communication technologies, and cannot be quickly eliminated.
Simon Segars, chief executive officer of ARM, said that there are so many Next Big Things happening now that it is difficult to determine where to start. The new communications protocol, whether it is 5G, LoRA, NBIoT and other new technologies, requires a lot of innovation in semiconductor equipment. Currently AI is driving cloud chips. At the edge, inferences are driving innovation in design.

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2018年5月15日星期二

Six of the Best Telegram Cryptocurrency Bots

Six of the Best Telegram Cryptocurrency Bots
They say the real riches you make in bitcoin are the friends you make along the way. And on platforms such as the crypto-friendly Telegram, it’s true that you can meet avatars who become acquaintances who become best mates. But the most useful accounts you’ll interact with on Telegram are arguably those devoid of humanity together. That’s because the best accounts are those operated by bots.

There’s a Crypto Bot for Every Occasion
Chatbots are not particularly new, nor are they unique to Telegram. But it is on the Russian messaging platform that they’ve gained the most utility, which owes something to the data-driven nature of the cryptocurrency space. Ordering your pizza via chatbot on Facebook Messenger is less efficient than conventional methods. Being alerted to market movements, on the other hand, is a job that’s best left to Telegram bots.

Price analytics are the most obvious implementation for Telegram crypto bots, and there is no shortage of candidates to choose from. Bitcoinpriceanalyticsbot lets you set an upper and lower limit; when bitcoin hits that threshold, you’ll be the first to know. Rocket Coin bot is another; type in a command such as /global and you’ll be shown the current cryptocurrency market capitalization including bitcoin dominance.


Deposit Notifications, New Token Listings, and More
If you’ve ever found yourself waiting for a cryptocurrency payment, you’ll know the frustration of refreshing a blockchain explorer in search of a sign. Tracktxbot is one of many Telegram bots promising to do away with manual checks. Enter your wallet address, give it a name if you like and you’ll be notified the moment you receive a deposit of BTC, BCH, ETH, or ERC20 tokens, as well as hundreds of other cryptocurrencies. This service can also alert you of funds leaving your wallet, allowing you to act fast in the event of unauthorized access.

The Tokenstats bot is another simple but extremely useful tool that will prove invaluable to ICO investors. Type in /ROI followed by the token abbreviation and you’ll be shown the return it’s made in ETH, BTC, and USD. Not all Telegram bots require manual setup and configuration using a series of commands: others simply require you to join the channel and follow along. Tokenstats Announcements will notify you of new tokens, while Crypto Exchange Listing “aims to accurately predict the listing of a new token on an exchange before the official announcement”. Its record, which is based on token deposits to known exchange wallets, is surprisingly good. You name it, there’s a bot for it.
Source from:bitcoin
Link:YIKESHU

2018年5月14日星期一

Digital microscopes introduces next gen visual inspection


VISION ENGINEERING EVO Cam II next-generation digital microscope is suitable for close inspection and recording of high resolution images, providing user customizable overlays, on-board measurement and Wi-Fi image transfer – all supported by a 30:1 optical zoom and a maximum magnification in excess of 3,600x. High definition images can be captured and stored directly to a USB memory stick. When connected to a PC, images and video can be easily captured, stored and shared. A Wi-Fi dongle even allows direct sharing with PCs, laptops, tablet computers and smartphones. Simple on-screen measurement can be performed with the aid of virtual callipers and scalable grids. Unit provides optical magnification range of 1.7x – 300x and a maximum magnification including digital zoom 3600x.

Source from:EPT
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2018年5月11日星期五

STMicroelectronics Energy-Efficient Monolithic Three-Phase, Three-Channel Current-Sense BLDC Driver: Extends Lifetime of Portable Devices and IoT Products

STMicroelectronics introduces the industry's first low-voltage brushless motor driver, the STSPIN233, for both single- and three-resistor sampling. The slim and compact motor driver integrates a 200mΩ 1.3 Arms power stage into a 3mm x 3mm package.

Not only that, the standby current of the STSPIN233 also set the lowest power consumption record in the industry, reaching below 80nA. In addition, it can also enter standby mode through logic control, which is ideal for extending the battery life of portable devices and IoT products. The scope of application includes drone camera heads, teaching robots, electric toothbrushes, and electric razors. Medical injectors or small drives built into IoT devices.
STSPIN233 power supply design is very simple, it has a 1.8V-10V input voltage range, even if only a single lithium-ion battery can easily drive. Built-in safety features include over-current protection, short-circuit protection and over-temperature protection, under-voltage lock protection, and interlocking to help further simplify system design.
In conjunction with the STSPIN233, there is also a development ecosystem that consists of the Nucleo expansion board (X-NUCLEO-IHM17M1) and associated software tools (X-CUBE-SPN17 supporting STM32Cube) to provide a simple and easy-to-use development tool. The STM32Cube software environment consisting of pieces of sample code and application code makes it easy for developers to quickly begin functional evaluation and prototyping.
With the introduction of the STSPIN233, STMicroelectronics now has a complete line of miniature monolithic low-voltage drivers suitable for controlling stepper, brush or brushless motors in small battery-powered devices. All products include STSPIN220, STSPIN230, STSPIN233, STSPIN240 and STSPIN250, each product is equipped with a dedicated Nucleo evaluation board and X-CUBE software package, to provide customers with flexible and varied product selection, including single and double brush motors or large Current (2.6 Arms) with brush motor controller, sensorless or sensorless BLDC controller, etc.
Currently, the STSPIN233 is available in a compact 3mm x 3mm QFN package.

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Nvidia Says Revenue Growth Depends on Cryptocurrency

Nvidia today released its financial report for the first quarter of fiscal year 2019 as of April 29. The earnings report shows that Nvidia’s highly-respected data center division’s revenue is lower than Wall Street’s expectation, and the microchip maker disclosed that its revenue growth is heavily dependent on the turbulent cryptocurrency market. Although the company’s overall revenue exceeded expectations, it still put pressure on its share price. The company’s first-quarter revenue increased by 65.6% year-on-year, but in Nasdaq’s after-hours trading on Thursday, the company’s share price fell 3.13% to US$252 at the time of writing.
The American chip maker’s first-quarter revenue growth was strong, with one side benefiting from its largest business – strong sales of game graphics chips, while also benefiting from new growth areas such as turning into data centers, artificial intelligence and self-driving cars. Achieved diversification of revenue sources.


The company also disclosed for the first time that in the first quarter, its fast-growing but unstable crypto-mining machine-chip business generated revenue of US$289 million, accounting for approximately 9% of its total revenue of US$3.2 billion in the first quarter. Stacy Rasgon, an analyst at market research firm Bernstein, said that this figure is higher than many analysts had previously expected of 200 million U.S. dollars, but Nvidia's announcement of this data should help investors measure its financial position in the company. The impact of the situation.

Colette Kress, CFO of Nvidia, said the company expects that in the second fiscal quarter, revenue related to cryptocurrency will be only about one third of the first quarter. Earlier this year, the retail price of Nvidia's gaming chips soared, as crypto-mining miners snapped up Nvidia's specially developed chips for cryptocurrency mining.

Kress told investors at the earnings conference call: “Although the supply of chips was tight earlier this quarter, the current situation is easing. Therefore, we are pleased to see that the price of our graphics processor (GPU) channels has started to be normal. In the past quarter, gamers outside the market have been excluded due to high prices in the previous quarter, and they can obtain the latest GeForce GTX gaming graphics at a reasonable price.”

In the first quarter, Nvidia’s data center business revenue was US$701 million, an increase of 71% year-on-year, but lower than the average forecast of US$703 million by analysts surveyed by Thomson Reuters. Nvidia's data center services support cloud services such as Amazon AWS, Microsoft Azure, and Alphabet's Google Cloud.

Kevin Cassidy, an analyst at Stifel, an investment company, said: “I think Nvidia's stock price is down, mainly because its revenue growth comes mainly from the cryptocurrency-related income.” He said Nvidia’s first quarter The profit was roughly in line with expectations, "but this may not be enough to make its share price 40 times earnings."

In the first quarter, Nvidia’s gaming chips revenue was US$1.72 billion, a year-on-year increase of 68%, which exceeded analysts’ average forecast of US$1.65 billion.

The cryptocurrency boom has fueled Nvidia's and its rival AMD's growth, as their graphics chips provide the high computing power needed to tap popular virtual currencies such as Bitcoin and Ethereum, but the current virtual currency prices Great fluctuations.

In the first quarter, Nvidia’s automotive business revenue reached US$145 million, a year-on-year increase of 4%, which exceeded the average analyst estimate of US$132 million. The company’s automotive business includes the Drive platform for self-driving cars.

In March this year, Nvidia suspended automatic driving tests worldwide. A week ago, a Uber's self-driving car killed a 49-year-old woman on the streets of Arizona.

In the first quarter ended April 29, the company’s net profit was $1.244 billion, or $1.98 per diluted share; the company’s net profit for the previous quarter was $1.118 billion, or 1.78 per diluted share. US Dollar; Net profit for the same period last year was US$507 million, or US$0.79 per diluted share.

The company’s total revenue for the first fiscal quarter was US$3.21 billion, an increase of 66% from US$1.937 billion in the same period last year.

Not according to U.S. GAAP, Nvidia's diluted earnings per share was $2.05.

According to Thomson Reuters, analysts had expected an average of 2.91 billion U.S. dollars in revenue for the first earnings report.

2018年5月10日星期四

Littelfuse Announces Arrays of Automotive TVS Diodes to Ensure Highest Reliability in the Most Rough Environments

Littelfuse Corporation today announced the launch of two AEC-Q101-compliant transient-suppression diode array (SPA® diodes) families. The AQHV and AQHV-C series are designed to provide extremely fast-acting, high-performance overvoltage protection devices that are best suited for power interfaces, passenger charging interfaces, and LED lighting modules and low-speed I/O.


                                    AQHV / AQHV-C Series TVS Diode Arrays

The 200W discrete AQHV series (unidirectional) and AQHV-C (bidirectional) products protect sensitive equipment from electrostatic discharge (ESD) and other overvoltage transients. Both series of products can safely absorb the highest level of repetitive electrostatic discharges higher than the international standards without causing performance degradation, and can safely dissipate up to 8A (AQHV12 series) at a very low clamping voltage Inrush current.
Typical applications for AQHV and AQHV-C series TVS diode arrays include:
· ESD protection of automotive electronics
· LED lighting module
· Mobile/handheld devices
CAN bus (telewire control)
· LIN bus RS-232 and RS-485 interface
· General low speed I/O
· Portable Instrument
"As a device that meets the requirements of AEC-Q101, the AQHV and AQHV-C series can ensure the highest reliability in the harshest environments," said Tim Micun, Director of Littelfuse's TVS Diode Array (SPA® Diode). "This makes it an excellent choice for designers who need to replace passive ESD protection devices or deploy protection devices on printed circuit boards."
The AQHV and AQHV-C series of TVS diode arrays have the following key advantages:
Up to ±30kV ESD protection and surge protection up to 8A help equipment manufacturers comply with industry standards and extend equipment life and system uptime.
Compared to alternative technologies, the lower dynamic resistance lowers the clamping voltage by 60%, which is ideal for protecting modern electronic products using small ICs.
The silicon diodes used in the structure can handle >1000 ESD shocks or transient surges without degrading performance, compared to alternative technologies that have inherent internal wear defects.
Availability
The AQHV and AQHV-C series of TVS diode arrays are available in SOD-882 (0402) surface-mount packages and are available in 10,000-reel tape packages.
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2018年5月9日星期三

Ultra-high bright LCDs come in 10.1”, 15.6” sizes


TIANMA GROUP 10.1-inch WXGA and 15.6-inch WXGA LCDs both deliver ultra-high luminance. The 10.1-inch wide model has a luminance of 1000cd/m2 and the 15.6-inch wide model has a luminance of 1250cd/m2. Device brightness results in displays with vivid colors and excellent visibility, even in direct sunlight. Products are suitable for industrial, outdoor viewable products.

Source from:EPT
More LEDs:YIKESHU

2018年5月8日星期二

CSR Launches Sixth Generation Bluetooth Chip

CSR announced the launch of its sixth-generation BlueCore Bluetooth chip. BlueCore6 offers industry-leading radio performance and low power consumption, and fully supports the latest Bluetooth specification (v2.1+EDR). BlueCore6 includes CSR's AuriStreamTM technology, which is a huge breakthrough in the way Bluetooth handles voice transmissions; AuriStream technology provides higher voice quality, and BlueCore6-ROM consumes less power than standard Bluetooth voice transmission methods. 40%. BlueCore6 will begin mass production in January 2008.

CSR further enhances RF performance and provides BlueCore6 with best-in-class Bluetooth coverage without the need for an external power amplifier. Compared to BlueCore4, BlueCore6's maximum allowable power loss standard value improves overall by 11dB (Tx input power +4dBm, Rx input power -7dBm), making BlueCore6 the most efficient Bluetooth radio in the industry and helping to improve the overall body operation For example, a connection between a Bluetooth headset and a mobile phone carried by the user is established. The BlueCore6-ROM is smaller than other brands of Bluetooth chips and is packaged using CSR's tested and validated wafer-level CSPs.

Voice is still an important application area of ​​Bluetooth technology. Users constantly demand higher voice quality and longer battery life. CSR's BlueCore4 is the world's leading Bluetooth chip. The currently launched BlueCore6 has all of its features and has made important improvements in voice quality and power requirements.

Fiona Thomson, senior analyst at IMS Research, a UK market research company, said: “Our research has found that consumers expect to have products with high performance and low power consumption, such as CSR's BlueCore6. CSR continues to introduce new products for Bluetooth products. Not only does it benefit consumers, but it also strengthens CSR's leadership in mobile phones and headsets, making it a preferred choice for manufacturers."

Traditionally, Bluetooth has relied on a Continuous Variable Slope Delta Modulation (CVSD) coding scheme to deliver voice over synchronous connection-oriented (SCO) links. CVSD is a fairly simple binary encoding scheme. We chose this solution because it is very reliable and error-proof. However, SCO does not allow retransmission of erroneous data packets. However, after the release of Bluetooth specification v1.2, eSCO can implement retransmission. Through the AuriStream technology, CSR introduced Adaptive Differential Pulse Code Modulation (ADPCM) as an enhanced speech coding method that can perform exactly the same function at half the rate of CVSD (ADPCM scan rate is 32Kbps, while CVSD is 64Kbps) saves half of the Bluetooth power consumption of your phone. ADPCM performs more accurately and provides higher voice quality. CSR's AuriStream technology raises the user's average opinion score for voice quality from CVSD's 2.41 to the current 4.14, enabling Bluetooth connectivity to the level of fixed-line voice.

CSR has adopted a variety of technologies on BlueCore6 that have greatly reduced the power consumption of Bluetooth or main devices. CSR reduced standby power consumption and adjusted the way Bluetooth devices scan other devices. On average, standby power consumes more than half of the overall power consumption in a Bluetooth system.

CSR's BlueCore6 uses two new scanning modes: conditional scanning and random scanning. By combining these technologies with BlueCore6-ROM, CSR saved 86% of Bluetooth power consumption in scanning mode.

When performing a condition scan, BlueCore only wakes up a minimum number of radios to perform a quick scan of 2.4 GHz band activity. If there is activity, it will initiate a formal Bluetooth paging scan/paging; if no activity is found, the radio will remain dormant.

CSR's random scan mode synchronizes the BlueCore6-ROM's periodic wake-up procedure with the attached baseband device so that VCTXO does not always wake up during the Bluetooth scan cycle. The Bluetooth chip typically shares a VCTXO with the mobile phone host system to minimize the use of other components and save the power consumption of the mobile phone system.

CSR CEO John Scarisbrick said: "BlueCore6 is CSR's most outstanding Bluetooth chip, and it provides new technology that is unique to any of our previous generations of products. BlueCore6 is ahead of any similar technology on the market today. This fully demonstrates that CSR continues to maintain its leading position in wireless innovation,” said Mr. Scarisbrick: “The major top mobile phone and headset manufacturers have expressed great interest in our BlueCore6 products.”

Bluetooth products attention TP

2018年5月6日星期日

So cool!YIKESHU 4 wheel 2 layer Robot Smart Car

Hello everyone.
I brought you another surprise today.
It is a 4 wheel 2 layer Robot Smart Car.
Give you a cool look first.
Next, I will introduce the performance of 4 wheel 2 layer Robot Smart Car.

High performance engine, making it easy to use and control / 1:18 full scale simulation design, as a real race car control / 2.4 GHz offers, for the strong anti-jamming ability.
Persistent superpower can play more than 30 minutes / radio remote control, the control distance is approximately 60m / Low chassis design for anti-rotation, ensures safe operation.
Climbing forward, backward, turn left, turn right over obstacles / independent suspension on all four wheels, shockproof, better protect the truck: With high quality tires, non-slip, perfect experience / function.
High strength and super flexible technical material to be adopted to make the body / technology design, ensures stable performance.
Battery: 3 x 1.5 V AA batteries for the transmitter (not included), 1 x 4.8 V 700 mAh Ni-Ca battery for the car / No signals to interfere with the operation of several cars.

This is a really cool 4 wheel 2 layer Robot Smart Car.
But even more pleasantly surprised.
I want to tell you that you can send it for free.
Only need to comment.
You can get it for free.
If you feel heart.
You can contact me.

Contact information
My mail box:1598962047@qq.com 
My shop:YIKESHU

2018年5月5日星期六

YIKESHU C-14 Remote Control Off-Road Racing Vehicles 1:16 2.4G 2CH 4WD Off-road Kids RC Toy Climb Semi Truck RTR Trailer(Red)

This time I'm going to introduce a remote-controlled off-road vehicle.

You will love it when you see it.
The red body looks very cool.
Let me introduce the performance.


4-wheel drive 1:16 scale off-road RC truck, high simulation.
Metal chassis helps to support the heavy load, durable and long life.
2.4Ghz CONTROLLER: 2.4GHz radio control provides an interference free operation which permits multiple RC cars racing together, so you can play in solo or racing with others for more fun; the LED lights provide a chance to race in night.
Power-efficient - driving for up to 25 minutes with the 6V 700mAh battery ( optional )
High-quality TPR tires, wear-resistant and suitable for driving on rugged roads.


I am doing activities now.
Comments can be sent for free.


You can also contact me
My mail box:1598962047@qq.com 
My shop:Shop YIKESHU







2018年5月3日星期四

Smart NFC chip has become standard

Talking about infrared, Bluetooth, and NFC on mobile phones, I believe we are not silent. The first three technologies are used to transfer data between machines. With the emergence of a large wave of data exchange software and changes in demand, these functions were slowly cut off by mobile phone manufacturers.

In recent years, these technologies have been widely used in technological advancement. More and more mobile phones have started to incorporate these hardware, but their functions are no longer single. Infrared is mainly used as a remote control, and the application of NFC is more extensive. Bank cards and public transportation cards can be swiped.
Starting from the iPhone 6, Apple has built in NFC chips in its mobile devices, but it is not open to developers and can only be used for Apple Pay. In some areas in China, you can use the iPhone to swipe the subway, but it is not available nationwide. universal. What is more interesting is that you can still use Apple Pay for payment without network support.

For Android phones, the smart NFC chip has basically become the standard for the new machine. Thanks to the open features of Android, it can do more. Not only can it be used to swipe bank cards, but it can also brush subway buses. At present, the flagship models of Samsung, Xiaomi, Huawei, Meizu and Nubia are all equipped with smart NFC chips. It is sufficient to go out in the first-line cities and other developed cities to bring mobile phones.
So, Android phone can still be used in the case of no electricity? If you are using the NFC card function, it is an rfid card that can be read and used by the reader, such as the reading of a public transportation card; if it is The interactive communication function is not available.
Bank cards or other magnetic cards are uncharged, read or change card contents, and are externally supplied with power. Then the mobile phone NFC does not belong to the physical card. It belongs to the virtual card. It is the mobile phone software that exchanges information with the NFC receiving terminal, and the receiving terminal device does not give the NFC the power. Therefore, the power required by the NFC exchange information is provided by the mobile phone. The power required for NFC exchange of information is small. As long as the NFC function is turned on, even if the mobile phone is turned off, it can support several NFC information exchanges by relying on the battery power.

That is to say, as long as you have turned on the NFC function and set the default card swiping mode, you can directly swipe the mobile phone into the subway bus in case of shutdown. Theoretically speaking, this argument is true. It is okay to test the millet 6 by yourself. However, due to the fact that the specific implementation principles of various manufacturers may differ, the specific situation has to be measured by oneself.

Other chips:YIKESHU

2018年5月1日星期二

4 wheels DIY smart car are free to send

I have a very cool DIY car here to share with you.

The use of four deceleration direct current machine curve to be nimble, the directivity is good. Four actuations, horsepower fullness. The chassis big and steady very easy to expand
Educational toys, help to improve the ability of children, suitable for young people at key stages of heart development
With a car platform, add some micro-controller (such as Arduino) and sensor modules, and program it. Then you made your own robot car
DC 6V 4-wheel Robot Smart Car Chassis Kits car with Speed Encoder for Arduino
Educational kit for beginners(kid) to get hands-on experience about Robotics & Can extend electronics system like Raspberry Pi Arduino etc to realize function of tracing, obstacle avoidance, distance testing, speed testing, wireless remote control.
Fortunately, you now see my share. Yes, we are doing activities now. We need 10 reviews to send this cool DIY car for free.
If you are interested and want to get it, please contact me. I will tell you the specific way of doing things.
my email:1499123520@qq.com

Super alarm clock

Are you worried about getting up in the morning and teaching you to be a super alarm clock. material: Large Electronic alarm clock*1 ...